Process Engineer - Circuit Card Assembly

2021-05-29 00:02:192021-10-06 Advantage Resourcing
Job Type Temp
Area Stevenage, United Kingdom Stevenage United Kingdom
Sector Engineering - Electrical Engineer
Salary £0 - £0
Currency GBP
Start Date ASAP
Job Ref er_837936
Job Views 581
Description

World Class Defence Organisation based in Bolton, Lancashire is currently looking to recruit a Process Engineer (Circuit Card Assembly) subcontractor on an initial 6 month contract.

This role would suit a candidate from a strong Manufacturing Engineer / Process Engineer who has experience of CCA (Circuit Card Assembly).

Contract Duration: 6 Months (initially and then ongoing and long-term thereafter)

Security Information:  Please Note you must be eligible for SC Security Clearance (unfortunately due to security restrictions for this role, the candidate will need to be a British National with no dual nationality and must have resided in the UK for at least 4 of the past 5 years).

Process Engineers (Circuit Card Assembly) Job Description:

As a Process Engineer within the CCA manufacturing facility your focus will be to ensure that our products are built efficiently, with the most modern tools available.

As a Process Engineer you will demonstrate ownership of processes and equipment in the SMT PCB manufacturing facility. Support equipment upgrades from purchase through installation. Conduct cost/benefit analysis for changes to processes and/or equipment. Drive Process Improvement / Cycle Reduction initiatives and drive productivity improvements via process change or improvements. Support the quality function through identification and elimination of product non-conformances.

Formal technical Engineering / Craft Apprenticeship to NVQ Level 3/TR23/TR21. Formal further education certificate to HNC or equivalent in a relevant subject. Experience in Circuit Card Assembly equipment. 5 years experience within SMT PCB manufacturing environment. Strong working knowledge of Electronic assembly, utilising the following equipment / processes: DEK printer, MYDATA, Solder reflow, Selective Solder etc. Experience of PCB ruggadisation processes such as Underfill and Conformal Coating would be advantages. Should be IPC J Std-001 and IPC-610 certified. Manual handling training. ESD training. Colophony health surveillance.

Skills and Experience Required:

Formal further education certificate to HNC or equivalent in a relevant subject. Experience in Circuit Card Assembly equipment.

Manufacturing engineering experience of RF assemblies / CCA’s preferred but not essential. Ideally needs to be familiar with RF assembly techniques (ATV soldering, wire / ribbon bonding etc).

5+ years experience within SMT PCB manufacturing environment would be great.

Strong working knowledge of Electronic assembly, utilising the following equipment / processes: DEK printer, MYDATA, Solder reflow, Selective Solder etc. Experience of PCB ruggadisation processes such as Underfill and Conformal Coating would be advantages.

Should be IPC J Std-001 and IPC-610 certified.

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